Radeon™ RX 5700 XT GAMING OC 8G (rev. 1.0)
Radeon™ RX 5700 XT GAMING OC 8G (rev. 1.0)
-
Price:FL 1,635.00
As low as FL 197.56/month with Learn more
- Out of stock
Description:
Featured
Powered by AMD Radeon™ RX 5700 XT
Integrated with 8GB GDDR6 256-bit memory interface
WINDFORCE 3X Cooling System with alternate spinning fans
RGB Fusion 2.0 – synchronize with other AORUS devices
Metal Back Plate
PCI-Express 4.0 Support
Core Clock
Boost Clock : up to 1905 MHz
Game Clock* : 1795 MHz (Reference card is 1755 MHz)
Base Clock : 1650 MHz (Reference card is 1605 MHz)
The WINDFORCE 3X cooling system features 3x 80mm unique blade fans, alternate spinning
fan, 5 composite copper heat pipes, heat-pipe direct touch and 3D active fan
functionality, together delivering an effective heat dissipation capacity for higher
performance at lower temperatures.
The GIGABYTE “Alternate Spinning” is the only solution that can solve the turbulent
airflow of three fans. The biggest problem with the three fans is turbulence. Since the
fans rotate in the same direction, the airflow direction is opposite between the
fans, which will cause turbulent airflow and reduce heat dissipation efficiency.
GIGABYTE turns the middle fan in the opposite direction, so that the airflow direction
between the two fans is the same, reducing the turbulence
and enhancing the airflow pressure.UNIQUE BLADE FAN
The airflow is spilt by the triangular fan edge, and guided smoothly through the 3D
stripe curve on the fan surface, effectively enhancing the airflow.3D ACTIVE FAN
The 3D Active Fan provides semi-passive cooling, and the fans will remain off when the
GPU is in a low load or low power game. It allows gamers to enjoy gameplay in complete
silence when the system is running light or idle.
HEAT PIPES DIRECT TOUCH GPU
The shape of the pure copper heat pipes maximize the direct contact area with the GPU,
enhancing heat transfer. The heat pipes also cover the VRAM through a large metal plate
contact to ensure proper cooling.
COMPOSITE HEAT-PIPE
The composite heat-pipe combines thermal conductivity and phase transition to efficiently manage the heat transfer between two solid interfaces which increases cooling capacity.